| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation device for an electronic component which can radiate the heat of the electronic component without using a heat-resistive material such as a grease or gel type insulating heat conductive material and an adhesive. SOLUTION: This device is equipped with a substrate 1, a heat-radiating electronic component 2 arranged on the substrate 1, a heat-conductive sheet 3 which abuts against the top surface of the electronic component 2, a heat sink 4 arranged on the heat-conductive sheet 3, and an elastic fixed sheet 5 which is fixed to the heat sink 4 and also has its end fixed to the substrate 1 while clamping the heat-conductive sheet 3 except the part abutting against the heat sink 4 with the heat sink 4. |
