TAPED WIRING BOARD AND METHOD FOR ASSEMBLING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a taped wiring board and method for assembling the same in which an electronic component, e.g. a semiconductor bare chip, can be flip-chip mounted easily and can be replaced before it is secured completely. SOLUTION: In a wiring board 101 mounting an electronic component, e.g. a semiconductor chip 105, the electronic component is covered partially or entirely with a tape 103 from above and secured to the wiring board 101 through adhesive 104 while being reinforced. The semiconductor chip 105 fixed with bumps 106 is thereby secured in place. The taped wiring board can be repaired after electrical test. A conductive adhesive may be employed in order to decrease a retaining pressure for ensuring contact.