| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize an acceleration sensor by improving the arrangement of an acceleration detecting chip and a signal processing chip in the acceleration sensor which is provided with both chips. SOLUTION: The acceleration detecting chip ACa is arranged at the inside of a through hole HL1 which is formed at the signal processing chip SCa. A cap CPa is installed so that a resin does not flow into an acceleration detection part AS when a resin-sealed package is formed. |
