| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package with a sapphire window having a good light transmission property for accommodation of a semiconductor element, which can effectively prevent deposition of metallic paste or foreign matter on a light transmission region, can be manufactured with a high yield and a good productivity, and can firmly hold joint of the window to a lid through a period of time. SOLUTION: The window 2 is provided along its full periphery with a groove or step difference 2a having a predetermined width, a metallized layer 2b having a thickness corresponding to or less than the depth of the groove or step difference 2a is formed in the step difference, and only a major surface of the window 2 is polished without polishing the metallized layer 2b. |
