发明名称 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component, by which the warp of a laminate in the case of lamination is prevented, lamination is enabled accurately and yield is improved. SOLUTION: In a process in which ceramic green sheets 3 and conductor layers 4 are laminated alternately on a supporting plate 1 and the laminate 5 is manufactured, the roles of carrying, positioning, fixing and the like can be fulfilled in the manufacturing facility of processes of lamination, cutting and the like because a reinforcing section 1a is installed around the forming section of the laminate 5 in the supporting plate 1, the bending strength resistance of the supporting plate 1 is increased and flatness can be held by mounting the reinforcing section 1a, and the ceramic green sheets 3 and the conductor layers 4 can be laminated accurately, thus manufacturing the ceramic electronic component having high quality with high yield.</p>
申请公布号 JP2001237153(A) 申请公布日期 2001.08.31
申请号 JP20000043914 申请日期 2000.02.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAGAI ATSUO;KURAMITSU HIDENORI
分类号 H01G4/12;H01G13/00;(IPC1-7):H01G13/00 主分类号 H01G4/12
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