| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method of connection terminals which can surely perform connection of terminals even if the width of the connection terminals becomes small, and to provide a manufacturing method of a semiconductor device and a semiconductor device. SOLUTION: Anisotropic conduction adhesive 24 including ionized metallic pieces 26 is applied to first semiconductor chip 12 where first connection terminals 18 are formed. A semiconductor chip 14 is brought close from above anisotropic conduction adhesive 24 is applied between the first semiconductor chip 12 and the second semiconductor chip 14. Then, voltage is applied between the first connection terminals 18 and the second connection terminals 22. When voltage is applied between the connection terminals, the metallic pieces 27 are drawn to the first connection terminals 18 and the density of the metallic pieces 26 near the connection terminals becomes high. When the first semiconductor chip and the second semiconductor chip are matched, secure bonding where the metallic piece are sandwiched can be performed. |
