| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing build-up multilayered printed wiring board by which such a good opening for via hole that no resin is left on its bottom can be formed when the opening is formed with a laser. SOLUTION: In this method, a laser receiving section 13 is composed of a land 3 which is formed on a solid copper surface 1, surrounded by a heat radiation preventing groove 2 from which copper is removed, and connected to the surface 1 through a connecting path 4. Further, the laser receiving section 13 is composed of a land which is surrounded by an insulating section and connected to another conductor circuit through a connecting path, and provided with a heat radiation preventing groove from which copper is removed on the outside of a laser receiving extent. |
