| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device which can treat a substrate at a high throughput. SOLUTION: Cleaning equipment 1 which cleans wafers W is provided with a treating vessel 2 which houses the wafers W, a steam supplying means 4 which supplies steam 3 into the vessel 2, and an ozone supplying means 6 which supplies an ozone gas into the vessel 2. The equipment 1 is also provided with a heating means 7 which heats the wafers W housed in the vessel 2, a cool air supplying means 8 which supplies cool air, and a waste solution discharging means 10 which discharges droplets from the vessel 2.
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