发明名称 HIGH-SPEED DETAILED LASER BEAM MACHINING METHOD AND ITS DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a high-speed detailed laser beam machining method and its device which make a laser beam eccentric and incident on a condensing lens and scan the condensing point on a substrate to be worked with a simple configuration. SOLUTION: The optical path from a laser oscillator 11 to a condensing lens 3 is provided with a plane glass 14 for making eccentric a laser beam 2 in the direction of X and a plane glass 15 for making eccentric in the direction of Y are provided in series, and then the laser beam is made to scan on the substrate to be worked by controlling the turning of the inclined angle of both planes glass 14 and 15.</p>
申请公布号 JP2001235701(A) 申请公布日期 2001.08.31
申请号 JP20000047470 申请日期 2000.02.24
申请人 NIPPON SHARYO SEIZO KAISHA LTD 发明人 NISHIWAKI YASUKI
分类号 G02B26/10;B23K26/06;B23K26/08;(IPC1-7):G02B26/10 主分类号 G02B26/10
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