| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treatment equipment which is used for heat-treating, for instance, a liquid crystal display device(LCD) substrate on which a resist film is formed, or a semiconductor substrate equipped with a heating plate on which the substrate can be mounted direct, and capable of preventing the substrate from being warped and keeping it uniform in temperature distribution. SOLUTION: The heat treatment equipment is equipped with a heating plate 82 which heat-treats a substrate mounted on its mounting surface and a mechanism which feeds a vapor having characteristics to remove static electricity to a contacting surface between the substrate and the heating plate 82. The middle part 83 of the heating plate 82 is formed of water-retentive material, and the upper part 79 on which the substrate is mounted direct is formed of porous ceramic or porous metal. Solvent is supplied to the water-retentive material and evaporated by heating, by which static electricity is prevented from being produced. |
