发明名称 TRANSCRIPTION MATERIAL AND MANUFACTURING METHOD THEREOF, AND WIRING BOARD MANUFACTURED BY USING TRANSCRIPTION MATERIAL
摘要 PURPOSE: A transcription material is provided to transfer a fine wiring pattern to a substrate easily and reliably and at a low cost. CONSTITUTION: The transcription material includes a first metal layer(101) having a concave and convex portion on a surface portion thereof. The convex portion of the metal layer(101) corresponds to a wiring pattern. A peel layer(102) made of an organic layer or a metal plating layer and a second metal layer(103) are formed on the convex portions. Namely, the transfer material has a three-layered structure in which the metal layer(101) is adhered to the second metal layer(103) with the peel layer(102) sandwiched therebetween.
申请公布号 KR20010083166(A) 申请公布日期 2001.08.31
申请号 KR20010006456 申请日期 2001.02.09
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ASAHI TOSHIYUKI;HIRANO KOICHI;KOMATSU SHINGO;MATSUOKA YASUYUKI;NAKATANI SEIICHI;SUGAYA YASUHIRO;YAMASHITA YOSHIHISA
分类号 H05K1/09;H01B13/00;H05K1/03;H05K1/11;H05K1/16;H05K1/18;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H05K3/20 主分类号 H05K1/09
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