发明名称 |
TRANSCRIPTION MATERIAL AND MANUFACTURING METHOD THEREOF, AND WIRING BOARD MANUFACTURED BY USING TRANSCRIPTION MATERIAL |
摘要 |
PURPOSE: A transcription material is provided to transfer a fine wiring pattern to a substrate easily and reliably and at a low cost. CONSTITUTION: The transcription material includes a first metal layer(101) having a concave and convex portion on a surface portion thereof. The convex portion of the metal layer(101) corresponds to a wiring pattern. A peel layer(102) made of an organic layer or a metal plating layer and a second metal layer(103) are formed on the convex portions. Namely, the transfer material has a three-layered structure in which the metal layer(101) is adhered to the second metal layer(103) with the peel layer(102) sandwiched therebetween.
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申请公布号 |
KR20010083166(A) |
申请公布日期 |
2001.08.31 |
申请号 |
KR20010006456 |
申请日期 |
2001.02.09 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ASAHI TOSHIYUKI;HIRANO KOICHI;KOMATSU SHINGO;MATSUOKA YASUYUKI;NAKATANI SEIICHI;SUGAYA YASUHIRO;YAMASHITA YOSHIHISA |
分类号 |
H05K1/09;H01B13/00;H05K1/03;H05K1/11;H05K1/16;H05K1/18;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):H05K3/20 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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