PUSHER ASSEMBLY OF MARKING DEVICE FOR SEMICONDUCTOR PACKAGES

摘要

PURPOSE: A pusher assembly of a marking device for semiconductor packages is provided which prevents a strip-type semiconductor package material from being jammed and damaged when the semiconductor package material is being transferred on a rail. CONSTITUTION: A pusher assembly(100) of a marking device for semiconductor packages includes a base part(10), a transfer part(20) and an elevation part. The base part has a support wall(12) in the form of rectangular plate. The support wall has a motor(13) set on one side of the wall. The rotating axis of the motor is combined with a ball screw(15) extended to the other side of the support wall. A limit(18) is attached to the support wall in parallel with the ball screw. The transfer part has a fix block(21) combined with the ball screw and the limit. The fix block has a pusher(28) for transferring a semiconductor package material in one direction and a pusher support bar(26) for supporting the pusher. The elevation part includes an up-down cylinder placed on one side of the support plate, and an up-down shaft(46) combined with the up-down cylinder and located in parallel with the limit. The up-down shaft moves the pusher support bar upward and downward.