发明名称 |
COPPER BAR WITH ADHESIVE FOR HEAT RADIATING PLATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a copper bar with adhesive for heat radiating plate, which is not deformed (warped) even after its bonding to a lead frame. SOLUTION: A cooper bar with adhesive is bonded to a face that is not a plating face 2 in a lead frame 1 and is used as a heat radiating plate 6. A liquid crystal polymer whose coefficient of thermal expansion is 10 to 20 ppm/ deg.C is used as an adhesive 5.
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申请公布号 |
JP2001237360(A) |
申请公布日期 |
2001.08.31 |
申请号 |
JP20000052105 |
申请日期 |
2000.02.23 |
申请人 |
HITACHI CABLE LTD |
发明人 |
YONEMOTO TAKAHARU;YAMAGISHI ISAO;HOSHI MASAHIRO;CHIBA KENICHI |
分类号 |
H01L23/34;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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