发明名称 COPPER BAR WITH ADHESIVE FOR HEAT RADIATING PLATE
摘要 PROBLEM TO BE SOLVED: To provide a copper bar with adhesive for heat radiating plate, which is not deformed (warped) even after its bonding to a lead frame. SOLUTION: A cooper bar with adhesive is bonded to a face that is not a plating face 2 in a lead frame 1 and is used as a heat radiating plate 6. A liquid crystal polymer whose coefficient of thermal expansion is 10 to 20 ppm/ deg.C is used as an adhesive 5.
申请公布号 JP2001237360(A) 申请公布日期 2001.08.31
申请号 JP20000052105 申请日期 2000.02.23
申请人 HITACHI CABLE LTD 发明人 YONEMOTO TAKAHARU;YAMAGISHI ISAO;HOSHI MASAHIRO;CHIBA KENICHI
分类号 H01L23/34;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/34
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