| 摘要 |
<p>PURPOSE: To provide method and apparatus for manufacturing a semiconductor element inexpensively while facilitating automation. CONSTITUTION: Electrical connection between the bumps 2 of a semiconductor element 1 and the pads on a mounting board utilizes shrinking force of a resin film 3, sandwiched between the semiconductor element and the mounting board, at the time of curing. The bumps 2 are formed collectively as the electrodes of respective semiconductor elements on a wafer 10 which is then bonded temporarily with the resin film 3 by vacuum lamination before being diced into individual elements. Cost can be reduced significantly as compared with a conventional method where bumps are formed on individual semiconductor elements and a resin film is fed onto the mounting board while matching the size for each semiconductor element at the time of mounting.</p> |
