| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for mounting an electronic part, for improved mounting efficiency by eliminating waste time. SOLUTION: An electronic part P is picked up by a transportation head 9 from a supply part 4 for an electronic part and then mounted on a substrate 3. Here, the height of an already-mounted part P1 on the substrate 3 to be delivered is measured with a height measuring means such as a CCD optical sensor comprising a light-projecting part and a light-receiving part. A transportation height h3 at which the transportation head 9 moves over the substrate 3 during mounting operation, is set to such height as a clearance C is assured between the already-mounted part P1 and the electronic part P based on the measuring result for part height. Thus, an excessive rising/falling operation of the transportation head is eliminated for eliminated waste time, resulting in improved mounting efficiency.
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