| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor chip by means of which a highly reliable semiconductor chip package can be obtained at low cost. SOLUTION: The method for mounting and sealing a semiconductor chip on a substrate while arranging it on the underside of surface comprises a step for applying sealant onto the substrate, a step for removing moisture from the substrate and the sealant, a step for mounting a semiconductor chip on the sealant applied onto the substrate from which moisture is removed, and a step for thermally setting the sealant after the semiconductor chip is mounted.</p> |
