SUBSTRATE TREATING METHOD AND SUBSTRATE TREATER

摘要

PROBLEM TO BE SOLVED: To properly control the flow of gas within treating spaces and to obtain treatment finished substrates having good characteristics. SOLUTION: In a substrate treating method comprising a process that substrates are transferred extending over a plurality of treating spaces and the substrates are treated within each treating space, a substrate treating method which is characterized by that the pressure in the one treating space out of the treating spaces and the pressure in at least the one treating space of the other treating spaces are controlled on the basis of the pressure in one of the treating spaces and a substrate treating device which is characterized by that the device has the plurality of the treating spaces, a substrate transfer mechanism to transfer the substrates extending over the plurality of the treating spaces, a pressure indicator to measure the pressure in one of the plurality of the treating spaces and a control unit to control the pressure in the one treating space and the pressure in at least the one treating space of the other treating spaces on the basis of information obtained from the pressure indicator are used.