发明名称 |
FLOOR STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a barrier-free floor structure having a floor heating. SOLUTION: This floor structure is formed of a reference floor part Fa for laying a floor panel 2 and a lower floor part Fb for laying a lower floor panel 3, the height of which is lower than the floor panel of the reference floor part Fa. The low floor part Fb is provided with a heating floor part 6 formed by arranging on the top face thereof a floor heating mat 4 capable of heating a floor finishing material 4a constituting a floor surface, and a heat insulating material-contained sheet body 5 interposed between the low floor panel 3 and the floor heating mat 4 fir positioning the floor finishing material 4a substantially at the same level with the floor surface of the reference floor part Fa. |
申请公布号 |
JP2001234627(A) |
申请公布日期 |
2001.08.31 |
申请号 |
JP20000044584 |
申请日期 |
2000.02.22 |
申请人 |
NATIONAL HOUSE INDUSTRIAL CO LTD |
发明人 |
YOKOYAMA KATSUMI;NAKAYAMA MAKOTO;TERAUCHI SUSUMU |
分类号 |
E04F15/18;F24D3/16;(IPC1-7):E04F15/18 |
主分类号 |
E04F15/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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