发明名称 FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a barrier-free floor structure having a floor heating. SOLUTION: This floor structure is formed of a reference floor part Fa for laying a floor panel 2 and a lower floor part Fb for laying a lower floor panel 3, the height of which is lower than the floor panel of the reference floor part Fa. The low floor part Fb is provided with a heating floor part 6 formed by arranging on the top face thereof a floor heating mat 4 capable of heating a floor finishing material 4a constituting a floor surface, and a heat insulating material-contained sheet body 5 interposed between the low floor panel 3 and the floor heating mat 4 fir positioning the floor finishing material 4a substantially at the same level with the floor surface of the reference floor part Fa.
申请公布号 JP2001234627(A) 申请公布日期 2001.08.31
申请号 JP20000044584 申请日期 2000.02.22
申请人 NATIONAL HOUSE INDUSTRIAL CO LTD 发明人 YOKOYAMA KATSUMI;NAKAYAMA MAKOTO;TERAUCHI SUSUMU
分类号 E04F15/18;F24D3/16;(IPC1-7):E04F15/18 主分类号 E04F15/18
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