| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can take a sufficient number of bumps with a low cost and a small size, and also to provide a method for manufacturing the device. SOLUTION: The semiconductor device includes a semiconductor element 1 having a plurality of electrodes 1a, a resin film 3 joined on its one surface to the element 1 and formed therein with through-holes 4 at positions corresponding to the plurality of electrodes 1a, a plurality of conductors 5 formed as extended from the other surface of the film 3 onto the through-holes 4 of the film 3, a plurality of bump electrodes 6 for joining the electrodes 1a of the element 1 and the conductors 5 on the film 3 via the through-holes 4, and a plurality of bumps 7 formed on the respective conductors 5 formed on the film 3. |
