| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier device that can prevent wafers from being damaged while the wafers are being carried. SOLUTION: This carrier device is composed of a hand 5 that grips a wager W so that a substrate surface becomes vertical, and a carrier robot 4 that performs conveyance so that the substrate surface of the wafer W is in parallel with a wafer movement direction, and the surface of the wafer that is vertically retained by the hand 5 is observed by a microscope having an objective lens 3a where a light axis J is horizontal, thus preventing the wafer W from being damaged without allowing the wafer W to bend by dead weight and air resistance in the conveyance. In addition, the observation is made while the wafer W is retained by the band 5, thus reducing the number of times for delivering the wafer in an inspection process, and hence reducing wafer damage when the wafer is delivered. |
