发明名称 |
INTEGRATED MODULAR PROCESSING PLATFORM |
摘要 |
PROBLEM TO BE SOLVED: To need a modular vacuum processing device which can readily maintain and/or reconstruct in response to a necessity in a site and has a high throughput of a substrate in an arbitrary temporal amount. SOLUTION: There is generally provided a modular vacuum processing device, and this modular vacuum processing device contains a main frame 300 for supporting a transfer chamber 302; one or more load locks 314, 316 and one or more processing chambers 322 to 326, mounted on the transfer chamber 302; and a chamber tray 380 associated with a modular main frame piping tray 350 and a processing chamber. A substrate ordering method is also provided in a method and device for processing the substrate. |
申请公布号 |
JP2001237297(A) |
申请公布日期 |
2001.08.31 |
申请号 |
JP20000365524 |
申请日期 |
2000.11.30 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
TEPMAN AVI;TODD CRAIG B;YU JAMES ENHAO;KIM DAEHWAN DANIEL;BUCHNER CHRIS;KUMAR SHIV |
分类号 |
C23C14/50;H01L21/00;H01L21/205;H01L21/302;H01L21/3065;H01L21/677;(IPC1-7):H01L21/68;H01L21/306 |
主分类号 |
C23C14/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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