| 摘要 |
<p>PROBLEM TO BE SOLVED: To miniaturize and lighten a packaged two-terminal semiconductor device in a state where prescribed bendability and heat radiating property are secured in the device constituted of one lead terminal 1 where a wide terminal part 1a is installed at a tip, a semiconductor chip 3 mounted on a terminal part 1 in one lead terminal 1, the other lead terminal 2 provided with a terminal part 2a overlapped and jointed with the semiconductor chip 3 at the tip, and a mold part packaging the part of the semiconductor chip 2. SOLUTION: The width size W2 of a terminal part 2a in the other lead terminal 2 is made to be narrower than the width size W0 of the other lead terminal 2 and to be 40 to 60% of the width size W1 of a terminal part 1a in one lead terminal 1.</p> |
