| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a contact wherein an electric conduction test is surely made and a lead terminal is protected, and operability, durability and test precision are improved and a downsizing of IC socket is made possible while minimizing a pressing load and stress generation, by extremely reducing a wiping phenomenon between a lead terminal and a terminal junction part at the time of pressure contact. SOLUTION: In the contact for the IC socket in which a terminal junction part 6 is integrally formed through a spring side part 4 that successively made a main stem part 5 contact with a support edge part 1, the spring side part 4 presents nearly U-form to sideways-facing consisted of an upper piece arm 2 which extends from a coupling part 8 to the terminal junction part 8 and a lower piece arm 3 which extends to the main stem part. Then, the upper piece arm 2 is consisted of the first spring part 2a and the second spring part 2b, which are separated from each other and extends in parallel and the lower piece arm 3 is consisted of the third spring part 3a and the fourth spring part 3b. Further, the spring side part 4 is slanted downward from the coupling part 8 side to the main stem part 5 side.</p> |
