| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which is superior in mechanical strength and can protect an IC chip when a shock is given. SOLUTION: A semiconductor device has an IC chip on which a circuit transferring data with an outer part without a contact is loaded, a supporting body on which the IC chip is loaded, a shock absorbing layer coating the surface side of the IC chip on a side which is not supported by the supporting body, and an overcoat layer covering the shock absorbing layer. |
