| 摘要 |
PROBLEM TO BE SOLVED: To provide a maunfacturing method for the electronic component where a surface-mounted component is housed in a shield case is efficiently manufactured. SOLUTION: A plurality of surface-mounted components 4 are mounted on a mother printed board 11 comprising a component connection electrode 12, an engagement hole 2, and a case fixing electrode 12 provided inside the engagement hole 2. Then, from the side of a component mounting surface, a solder paste 7 is so applied that the engagement hole 2 is not filled with it, in a region around the engagement hole 2 on the mother printed board 11 or in a region which covers at least a part of the engagement hole 2 and that around the engagement hole 2. An engagement part 6 of a shield case 5 is inserted in the engagement hole 2 so that a plurality of shield cases 5 engage with the mother printed board 11. Then a solder 7a in the solder paste 7 is melted so that the engagement part 6 of the shield case 5 is soldered to a case fixing electrode 13 in the engagement hole 2. After that, the mother printed board 11 is cut into individual electronic components 10. |
