| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for manufacturing a laminated ceramic electronic component, by which the shrinkage of the lower section of the laminate of ceramic green sheets after contact bonding can be inhibited and the displacement of patterns formed inside can be reduced. SOLUTION: A recessed section 18 is formed to the peripheral section of the central section 16 of a bottom force 14, and the laminate 24 of a plurality of the ceramic green sheets is arranged inside a frame member 20 and contact- bonded by a top force 22. Thus, the end section of the laminate 24 is penetrated into the recessed section 18, and the deformation of the laminate 24 is inhibited against the contraction stress of the sheets in the lower section of the laminate 24. |
