| 摘要 |
PROBLEM TO BE SOLVED: To simply easily form a holding structure and seal part, to facilitate the manufacture, and to obtain necessary and sufficient heat dissipation. SOLUTION: First and second case members 13 and 15 which store a substrate 19 with a mounted electronic component 17 in an internal space S are made of resin material, and a heat dissipation component 41 provided to the 1st case member 13 is mounted in a through hole 31 of the 1st case member 13. One end of the heat dissipation component 41 is provided in the internal space S and the other end of the heat dissipation component 41 is exposed to outside the 1st case member 13.
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