| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for receiving a semiconductor device which prevents moisture from entering the depression of an insulating base body and can normally stably operate a semiconductor device received in the depression for a long time, in manufacturing the insulating base body using a thermoplastic resin. SOLUTION: The package for receiving a semiconductor device includes an insulating base body 3 formed of a thermoplastic resin and having a depression 2 for receiving a semiconductor device 1, and a covering member 4 for covering the depression 2 of the insulating base body 3. The insulating base body 3 formed of the thermoplastic resin contains 0.1 to 50%, by mass, moisture absorbing material. Even if moisture in the air is absorbed by the insulating base body 3 formed of the thermoplastic resin, the moisture is absorbed by the moisture absorbing material to prevent the moisture from passing through the insulating base body 3 into the depression 2.
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