发明名称 |
ASSEMBLING METHOD FOR LIGHT-RECEIVING/EMITTING MODULE FOR OPTICAL PICKUP |
摘要 |
PROBLEM TO BE SOLVED: To allow high accuracy assembly of a light-receiving element for an optical pickup at low-cost facility and less processes. SOLUTION: A light-receiving element block 5 is so worked that its length is L-α against L of a light-receiving element, its width being equal to W of the light-receiving element, and its height is a prescribed value which satisfies relationship with a light-emitting part 3a of a light-receiving part 4a in terms of height. Both the light-receiving element block 5 and a light-emitting element block 1 are fitted to a common base stage, so that the upper surface of the block 5 is away from the block 1 with a gap equal to α/2 or smaller. With this configuration, a solder ribbon 6 and a light-receiving element 4 are placed in the order on the upper surface of the light-receiving element block 5. They are heated together with the base stage to fully melt the solder and then cooled. The light-receiving element 4 hits against the light-emitting element block 1 under the surface tension of the molten solder, to establish accurate light- receiving/emitting distance. |
申请公布号 |
JP2001237485(A) |
申请公布日期 |
2001.08.31 |
申请号 |
JP20000048377 |
申请日期 |
2000.02.24 |
申请人 |
CITIZEN ELECTRONICS CO LTD;CIMEO PRECISION CO LTD |
发明人 |
KOBAYASHI KAZUHIRO;IWASAKI NAOICHI;FUJISAWA KAZUMASA |
分类号 |
G11B7/125;G11B7/22;H01L31/0232;H01S5/022 |
主分类号 |
G11B7/125 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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