| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, and an electronic apparatus comprising it, having high manufacturing yield and high reliability by suppressing undue interfacial reaction when a chip component, especially an IC chip, is bonded to a mounting member through soldering bumps thereby protecting soldered parts against damage due to thermal and mechanical variation at the time of manufacture or operation. SOLUTION: A semiconductor basic body is bonded onto a mounting member, provided with conductor wiring on the surface thereof, through bumps of solder material composed of tin (Sn) or more than one kind of substance selected from tin (Sn), antimony (Sb), silver (Ag), Copper (Cu), nickel (Ni), phosphorus (P), bismuth (Bi), zinc (Zn), gold (Au) and indium (In). The semiconductor basic body, the bumps and the mounting member are molded of thermosetting resin to produce a semiconductor device which is employed in an electronic apparatus. |
