| 摘要 |
PROBLEM TO BE SOLVED: To provide a one system module in which ceramic PCB and epoxy PCB are rigidly fixed to a module main body and which is made to be compact. SOLUTION: Grooves are formed at the lower part and near the middle part of the inner sidewall of a module main body 100. Ceramic PCB 101 and epoxy PCB 102 are inserted into the grooves. Power pins 104 to which power signals from outside are inputted are mounted on ceramic PCB 101. Signal pins 105 to which various signals from outside are inputted are mounted on epoxy PCB 102 by separating them from the power pins 104 so as to constitute a one system module. |
