| 摘要 |
PROBLEM TO BE SOLVED: To accurately package a laser diode with small number of man-hours, using a highly general-purpose device. SOLUTION: A metallized pattern 3 is formed on the upper surface of a mount 2 that is made of a pyrogenic conductive material such as ceramics, the width is set nearly equal to the width of a light-emitting device 1, and the length is set shorter than a length L of the light-emitting device 1 byα. Also, a leading pattern 3a with width that is L/2 or smaller is formed in both the width directions from a central part in the longitudinal direction of the metallized pattern 2. When the light-emitting device 1 is to be mounted onto the mount 2, a solder ribbon 4 is placed on the metallize pattern 3 through alignment, and then the light-emitting device 1 is placed from a part on it. The mount 2 is heated in a heating furnace in a nitrogen atmosphere, and is inverted when solder is melted. A self-alignment operation operates on the light-emitting device 1 due to the operation of the surface tension of solder, thus achieving accurate packaging along the metallize pattern 3 by cooling.
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