ELECTRONIC COMPONENT MOUNTING METHOD AND SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting method of high productivity wherein solder can be easily supplied to electrode pads even if a substrate has a restricted plane part, and a substrate for mounting an electronic component to which solder is supplied by the method and which has high added value. SOLUTION: A plurality of solder bumps 1 are formed by using a solder wire (1), so that solder is supplied to the electrode pads 3 of the substrate 2.