发明名称 CARRIER CONNECTION STRUCTURE OF ELECTRIC CIRCUIT MODULE AND ELECTROMAGNETIC SHIELD STRUCTURE
摘要 PROBLEM TO BE SOLVED: To stabilize electric contact between carriers while electromagnetic shield performance is improved by preventing poor electric contact at a carrier's conductive interconnection part which functions as a ground of an electric circuit. SOLUTION: Guide channels 8 and 9 are formed at interconnection surfaces 2a and 3a of conductive carriers 2 and 3 which are provided in a case, adjoining each other, and a conductive member 10 is inserted in the guide channels 8 and 9 so that the carriers 2 and 3 are electrically connected each other. Guide channels 14 and 15 are formed at joint surfaces 12 and 13 of the case 1 and a lid 11, and a conductive member 16 is inserted in the guide channels 14 and 15 so that the case 1 and the lid 11 are electrically connected.
申请公布号 JP2001237583(A) 申请公布日期 2001.08.31
申请号 JP20000045623 申请日期 2000.02.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 TSUYAMA YASUNORI;ISODA YOJI;KAWAKAMI KENJI;HAYASHI KAZUTAKA
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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