| 摘要 |
The invention concerns a method for fixing a module (1) to a card body (2), the module comprising an integrated circuit (3) mounted on a support (4) provided with conductive pads (5) and the card body comprising a cavity (7) for receiving the integrated circuit. Said method comprises the following steps: mounting the module on the card body such that the integrated circuit is housed in the cavity and leaves a free volume (16) therein; injecting a resin (17) into the free volume; polymerising the resin.
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