发明名称 HIGH HEAT CONDUCTIVITY WATERTIGHT PACKING
摘要 PROBLEM TO BE SOLVED: To provide high heat conductivity watertight packing having high heat conductivity and capable of surely sealing the connection of the case or cover of an outdoor device against water. SOLUTION: The high heat conductivity watertight packing 10 has a heat conducting member 2 formed of a corrugated metallic plate buried in a seal member 1 made from an elastomer. The packing 10 is mounted between flange surfaces 20, and when flanges 16 and 18 are clamped together, the seal member 1 and the heat conducting member 2 are compressed and brought into close contact with the flange surfaces 20 to seal the flanges against water and allow heat to conduct between the flanges for radiation of the heat.
申请公布号 JP2001235034(A) 申请公布日期 2001.08.31
申请号 JP20000045807 申请日期 2000.02.23
申请人 NEC ENG LTD 发明人 OKOCHI MINORU
分类号 F16J15/10;F16J15/12;(IPC1-7):F16J15/10 主分类号 F16J15/10
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