RESIN COMPOSITION, ADHESIVE FILM, METALLIC FOIL-ADHERED ADHESIVE FILM USING THE RESIN COMPOSITION, CIRCUIT BOARD AND MOUNTED STRUCTURE

摘要

PURPOSE: To obtain a resin composition having low elastic modulus, causing very small thermal stress in mounting flip chips and having high thermostability capable of solder float at 300deg.C and to obtain an adhesive film and a metallic foil-adhered adhesive film using the resin composition, and to obtain a circuit board and a mounted structure. CONSTITUTION: This resin composition is obtained by including (A) a polyamide containing siloxane linkage, (B) an acrylic polymer having >= 500,000 weight- average molecular weight, (C) a thermosetting resin and (D) a solvent. The second objective adhesive film and metallic foil-adhered adhesive film are each obtained by using the resin composition, the other objective circuit board and a mounted structure each obtained by using the above metallic foil-adhered adhesive film.