发明名称 THERMOPLASTIC RESIN COMPOSITION AND SHEETS AND CARDS MADE FROM THE SAME
摘要 Cards which contain any one of the following thermoplastic resin compositions I to III in its material can be used as magnetic cards, IC cards, etc. since they are excellent in heat resistance, processability and embossability: I. A composition consisting of the following ingredients (A) and (B) II. A composition consisting of the following ingredients (A), (B) and (D) III. A composition consisting of 100 parts by weight of one or more selected from the following ingredients (A), (B) and (D) and 2 to 25 parts by weight of the following ingredient (C) (In the above I to III, the Ingredient A is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at 1 or more; ingredient B is an aromatic polycarbonate; ingredient C is an inorganic sheet-like filler of 0.5 to 20 mum in average grain size; and the ingredient (D) is a polyester composed of dicarboxylic acid components with terephthalic acid component as a main dicarboxylic acid component and ethylene glycol component (I) and 1,4-cyclohexanedimethanol component (II) as main glycol components, with the molar ratio (I)/(II) of ethylene glycol component (I) to 1,4-cyclohexanedimethanol component (II) kept at smaller than 1.)
申请公布号 US2001018111(A1) 申请公布日期 2001.08.30
申请号 US19980051063 申请日期 1998.04.13
申请人 SUGIE RYUICHI;NISHIMURA TORU;HIRATSUKA MOTOKI 发明人 SUGIE RYUICHI;NISHIMURA TORU;HIRATSUKA MOTOKI
分类号 B32B3/30;B32B27/36;B32B38/06;C08J5/18;(IPC1-7):B32B3/26 主分类号 B32B3/30
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