| 摘要 |
PURPOSE: To provide an apparatus for producing semiconductor in which the pitch of adjacent wafer cassette containing grooves is widened while reducing the size of the wafer cassette. CONSTITUTION: A wafer cassette 1a having means for partially widening the containing pitch of semiconductor wafer is provided. The wafer cassette 1a has a plurality of wafer trays 2 for containing semiconductor wafer 41 while mounting one by one. The means for widening the pitch comprises a pair of linear guides 6 coupled with the opposite end parts of stacked wafer trays 2 and moving each wafer tray 2 up and down, a vertical cassette drive motor 4 for moving the wafer tray 2 stacked on a mounting table 5 to a specified position, and a lock cylinders 7 provided at an interval larger than the thickness of the wafer tray 2 and secure the wafer tray 2 moved to the specified position securing grooves 3 made at the opposite end parts of the wafer tray 2 by inserting securing pin parts 7c.
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