Half-relief structure forming process for board material involves compressing and heating material with template for structure on it between two rigid plates

摘要

The half-relief structure-forming process involves compressing and heating the material with a template for the half-relief structure on it between two rigid plates such as those of a hydraulic press, applying both pressure and heat. Fiberboard of density about 890 kg/m3> or cardboard can be used as the initial material.