| 摘要 |
A primed substrate for manufacture of a printed circuit board. At least part of the substrate is coated with a film formed by contacting a solution containing at least one film forming amine and enough acid to produce a pH of less than about 6.5. The film promotes adhesion of subsequently applied layers by inhibiting substrate oxidation and catalytic polymerization of monomers and polymers at the interface between the substrate and a resist surface by resisting resist contact with the substrate. The film enhances resist adhesion to alloys, copper, or other materials. The acid can be an organic acid, an inorganic acid, or a combination.
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