| 摘要 |
A lead frame is conveyed on a lead frame conveying rail to a bonding paste coating stage. When the lead frame reaches the bonding paste coating stage, a cylinder containing a paste therein is lowered and the bonding paste is applied in a point-like fashion to an island portion of the lead frame on which a die is bonded. When the application of the bonding paste in a point like fashion is completed, the cylinder is lifted. An ultrasonic vibration generating device is provided directly below the lead frame at the bonding paste coating. The ultrasonic vibration generated device is operated during the application process of the bonding paste to contact into with the understand of the lead frame to apply ultrasonic vibration to it.
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