| 发明名称 |
Chemical planar head dampening system |
| 摘要 |
An improved polishing apparatus having a dampening system to prevent fluctuations between the planar head polishing device and the circuit panel. The dampening system includes a load actuation arm having a hydraulic-pneumatic cylinder which is controlled by an connected dampening circuit.
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| 申请公布号 |
US2001018320(A1) |
申请公布日期 |
2001.08.30 |
| 申请号 |
US20010825018 |
申请日期 |
2001.04.03 |
| 申请人 |
CASE JAMES R.;KIBALLA GERALD A.;SHUMAN MICHAEL A. |
发明人 |
CASE JAMES R.;KIBALLA GERALD A.;SHUMAN MICHAEL A. |
| 分类号 |
B23Q11/00;B24B41/00;B24B41/06;B24D13/02;F16F15/027;H05K3/26;(IPC1-7):B24B7/00;B24B9/00 |
主分类号 |
B23Q11/00 |
| 代理机构 |
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代理人 |
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