| 摘要 |
PURPOSE: A method for forming bumps on electrode pads is provided to form a good connection between the main chip and the rewiring substrate, while the two sub-chips were held between the main chip and the rewiring substrate. CONSTITUTION: The positioning of the substrate(1) is performed by putting the substrate(1) inside a recess(40) in a substrate support(4). The recess(40) has an open surface area corresponding to the plan view surface area of the substrate(1), but its depth is less than the thickness of the substrate(1). Accordingly, only the lower part of the substrate(1) fits into and is positioned in the recess(40), which restricts the movement of the substrate(1). The formation of the first cover layer(21) is performed by coating the substrate(1) with a solution of a polyacrylic acid, polyvinyl alcohol, or other such macromolecule with high water solubility by a know process such as spin coating or screen printing. The formation of the second cover layer(22) is performed by subjecting a resin film containing a highly photopolymerizable or photodegradable material to hot press bonding over the first cover layer(21). The formation of the openings(23) is performed by forming second openings(22a) corresponding to the second cover layer(22) and, at the same time, forming first openings 21a corresponding to the first cover layer(21). |
