ELECTRONIC SUPPORTS AND METHODS AND APPARATUS FOR FORMING APERTURES IN ELECTRONIC SUPPORTS

摘要

The present invention provides an electronic support (210) comprising: (A) a prepeg layer (214) comprising: (1) at least one reinforcement material (220) ; (2) at least one matrix material (216) in contact with at least a portion of the at least one reinforcement material (220); and (B) at least one layer (217) in contact with at least a portion (224) of at least one surface of th e prepeg layer (214), the at least one layer (217) comprising at least one inorganic filler (218) and not greater than 25 weight percent of adhesive materials based on the total weight of at least one layer (217) on a total solids basis.