发明名称 |
Cleaning agent |
摘要 |
Removing particles and metallic contaminants without corrosing the metallized wirings and without giving adverse effect of planarization on the semiconductor substrate surface can be effectively achieved by use of a cleaning agent which comprises an organic acid having at least one carboxyl group and a complexing agent having chelating ability.
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申请公布号 |
US2001018407(A1) |
申请公布日期 |
2001.08.30 |
申请号 |
US20010789736 |
申请日期 |
2001.02.22 |
申请人 |
WAKO PURE CHEMICAL INDUSTRIES, LTD. |
发明人 |
KAKIZAWA MASAHIKO;ICHIKAWA OSAMU;HAYASHIDA ICHIRO |
分类号 |
C11D7/26;C11D7/32;C11D11/00;H01L21/306;(IPC1-7):C11D1/00 |
主分类号 |
C11D7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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