| 摘要 |
<p>A chemical-mechanical polishing device wherein an elastic member (16) disposed between a polishing pad (12) and a platen (14) has a hardness of 10 - 40 defined in JIS K6301 (A type) and a thickness of 5 - 30 mm. Further, the polishing process in damascene wiring formation is effected in two steps. The first polishing step uses the elastic member of above-mentioned quality, and the second polishing step uses a material whose hardness defined in JIS K6301 (A type) is 50 or more.</p> |
