发明名称 Semiconductor device with low resistivity film embedded and manufacturing method for the same
摘要 A semiconductor device includes a first insulating film, a first conductive layer, a gate insulating film and a gate electrode. The first insulating film is formed on inner walls other than a top portion of each of grooves which are formed in a surface of a semiconductor substrate. The top portion is near to the surface of the semiconductor substrate. The first conductive layer is formed to fill a concave portion to the surface of the semiconductor substrate and to having a portion extending from the top portion into a portion of the semiconductor substrate. The concave portion is formed by the first insulating film in each of the grooves, and the first conductive layers function as source and drain regions. The gate insulating film is formed to cover the first conductive layer and the semiconductor substrate. The gate electrode is formed on the gate insulating film to form a MOS transistor.
申请公布号 US2001018249(A1) 申请公布日期 2001.08.30
申请号 US20010792303 申请日期 2001.02.23
申请人 TANAKA TAKAO 发明人 TANAKA TAKAO
分类号 H01L21/70;H01L21/8246;H01L27/112;(IPC1-7):H01L21/336 主分类号 H01L21/70
代理机构 代理人
主权项
地址