发明名称 |
Method for regenerating semiconductor wafers |
摘要 |
A process is described for recycling test wafers used for quality control or damaged wafers used in the context of chip production by regenerative removal of the previously applied layers. The method is based on the object of developing a cost-effective, environmentally friendly and time-saving regeneration method. The object is achieved by removing the applied layers by wet blasting using a specific blast material.
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申请公布号 |
US2001018242(A1) |
申请公布日期 |
2001.08.30 |
申请号 |
US20010796209 |
申请日期 |
2001.02.28 |
申请人 |
KRAMER HANS;TAUBERT MATTHIAS;LOIBNEGGER GERNOT |
发明人 |
KRAMER HANS;TAUBERT MATTHIAS;LOIBNEGGER GERNOT |
分类号 |
B24C3/32;H01L21/304;H01L21/306;(IPC1-7):H01L21/823 |
主分类号 |
B24C3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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