发明名称 |
METHOD OF FORMING LEAD-FREE SOLDER ALLOYS BY ELECTROCHEMICAL DEPOSITION PROCESS |
摘要 |
A method of forming lead-free solder bumps includes sputtering a titanium-tungsten (TiW) layer on the surface of a semiconductor wafer and a copper layer on the titanium-tungsten layer. Photoresist is used to define a contact area on the copper layer. A layer of solderable electrically conductive material is plated on the sputtered copper layer in the contact area, a layer of silver is plated on the solderable material, and a layer including tin is plated on the silver. The photoresist material is removed and, using the tin, silver, and solderable material layers as a mask, the sputtered copper and the titanium-tungsten are etched away from the surface of the wafer surrounding the contact area. The tin, silver, and solderable material layers are then reflowed to form a solder alloy bump. |
申请公布号 |
WO0163668(A2) |
申请公布日期 |
2001.08.30 |
申请号 |
WO2001US04956 |
申请日期 |
2001.02.15 |
申请人 |
MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE |
发明人 |
MOLLA, JAYNAL, ABEDIN;LYTLE, WILLIAM, HINES |
分类号 |
H01L21/60;H01L23/485;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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